Bond Force is a seventh generation single component light-cured, self-etching dental adhesive that requires one application to achieve award winning bond strength. The self-leveling technology allows for a uniform adhesive layer that has a film thickness as thin as 8µm. Bond Force is designed to be used on both cut/uncut enamel and dentin.
Pen Intro Kit: 2 ml Pen, 25 Disposable Applicators, Dispensing Well
Unit Dose Kit: 20 x 0.1 ml Unit Dose, 25 Disposable Applicators
Features and Benefits
- Outstanding bond strength
- Thin film thickness (8µm)
- Designed for cut/uncut enamel and dentin
- Only one application required
- One Step: No etching, No rinsing, No mixing self-leveling technology
- Extended working time (5 minutes)
- Fluoride releasing
